OZER Advanced Technologies offers creative Thermal, Materials, and Mechanical Technology solutions for RF Power microelectronics packaging applications

OZER Advanced Technologies specializes in Advanced Thermal Solutions using Reticulated Metal Foams, Microelectronics, RF and Power Electronics Packaging Thermal and Structrual Reliability Analysis.

High stiffness and light weight structures with or without thermal functions are among the main applications of metal foams.

We primarily specialize in metal foam-based, active and passive Heat Exchangers.

Modeling, designing, and prototyping the testing of air or liquid cooled, and phase change heat exchangers are our main function.

METAL FOAM HEAT EXCHANGERS